The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2003

Filed:

Dec. 29, 1999
Applicant:
Inventors:

Rakesh Bhatia, Austin, TX (US);

Eric DiStefano, Livermore, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.


Find Patent Forward Citations

Bhatia, Rakesh. (2003). Low thermal resistance interface for attachment of thermal materials to a processor die (U.S. Patent No. 6570764). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6570764

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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