The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2003
Filed:
May. 10, 2000
Toshiya Uemura, Aichi-ken, JP;
Takahide Oshio, Aichi-ken, JP;
Toyoda Gosei Co., Ltd., Nishikasugai-gun, JP;
Abstract
A wafer comprising a semiconductor layer formed on a substrate is diced on the back surface of the substrate to a depth of about ¾ thickness of the substrate. Thus a separation groove is formed in a direction of a dicing line. A groove is formed at the portion of the semiconductor layer corresponding to the groove . The groove reaches the substrate. The back surface of the substrate is polished until the substrate become a lamella having only a trace of the groove . A metal layer is formed by depositing aluminum (Al) so as to cover the entire back of the substrate , and a groove formed at the portion of the metal layer corresponding to the groove . An adhesive sheet is adhered on an electrode pad . A scribe line is formed by scribing the metal layer along the groove . The wafer is loaded by a roller in a breaking process. Accordingly, a wafer having the metal layer on the back surface of the substrate can be obtained. Light transmitted to the substrate is reflected by the metal layer, resulting in improving effectivity of ejecting light from the electrode A and B. And a luminous intensity of the device can be also improved.