The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2003
Filed:
Aug. 11, 2000
Paul D. Lucas, Melrose, MA (US);
John Denner, Lynn, MA (US);
Chris P. Grudzien, Lowell, MA (US);
Jeff Lischer, Acton, MA (US);
Kristen Weight, Stow, MA (US);
MKS Instruments, Inc., Andover, MA (US);
Abstract
A pressure transducer assembly includes a first body, a second body, a diaphragm, and an electrode. The diaphragm is mounted between the first and second bodies. The first body and the diaphragm form a first chamber. The second body and the diaphragm form a second chamber. The electrode is disposed in the first chamber. A portion of the diaphragm flexes in a first direction in response to pressure in the first chamber being greater than pressure in the second chamber. A portion of the diaphragm flexes in a second direction, opposite the first direction, in response to pressure in the second chamber being greater than pressure in the first chamber. A capacitance between the electrode and the diaphragm is representative of a difference between the pressures in the first and second chambers. In some embodiments, the electrode is suspended from a hub and spoke mounting. In some embodiments the electrode is entirely metallic. In other embodiments, the electrode includes a ceramic disk with a conductive film formed on the disk and the disk is coupled to the housing with a ceramic rod. In some embodiments, the transducer also has a low thermal coefficient of expansion member connected to the housing for reducing warping in response to temperature changes. In additional embodiments, the disk includes a groove that reduces the effects of temperature variations on a ceramic electrode.