The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2003

Filed:

Jul. 09, 2001
Applicant:
Inventors:

Mohamad Jahanbani, Tianjin, CN;

Stefan Ruemmelin, Dresden, DE;

Ronald Hoyer, Dresden, DE;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F26B 2/106 ;
U.S. Cl.
CPC ...
F26B 2/106 ;
Abstract

A device for performing surface treatment on semiconductor wafers has a cassette ( ) for accommodating a plurality of wafers ( ) in its interior ( ); the wafers ( ) are aligned in a first row. The wafer surfaces ( ) are essentially in parallel with each other. The cassette ( ) has a side-wall ( ) which can be arranged essentially perpendicular with respect to the wafer surfaces ( ); the side-wall ( ) has openings ( ) on its face ( ) which is directed to the wafers ( ), the openings ( ′) are aligned in second rows, the second rows are essentially parallel to the first row; the openings ( ′) are connected to respective supply channels ( ) for transporting a surface treatment medium which is fed to one ( ′) of these supply channels via a feeding point (FP). The cross-section of the openings ( ′) is variable.


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