The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
Mar. 21, 2001
Applicant:
Inventors:
Hideaki Tamai, Tokorozawa, JP;
Yasuyuki Komachi, Akishima, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 9/00 ;
U.S. Cl.
CPC ...
H01R 9/00 ;
Abstract
So as to obtain a pin-form wire having a stable high-quality shape without being affected by the back tension in a bonding wire, a capillary of the bonding apparatus, with the formed pin-form wire inside the capillary, is move along a curved path has a shape of a bent wire to be formed after forming the pin-form wire by a wire bonding apparatus.
Tamai, Hideaki. (2003). Bent wire forming method (U.S. Patent No. 6564453). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6564453
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile