The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2003
Filed:
Oct. 27, 2000
Sony Chemicals Corporation, Tokyo, JP;
Abstract
Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask is formed on a bump-forming surface of a metal foil which has a thickness that is the sum of the thickness t of the wiring circuit and the height t of the bumps which are to be formed on the wiring circuit (t +t ), and then the bumps are formed by half-etching the metal foil to a depth corresponding to the desired bump height t from the bump-formation etching mask side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.