The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2003

Filed:

Feb. 20, 2001
Applicant:
Inventors:

Kazumi Watase, Kyoto, JP;

Hiroaki Fujimoto, Hirakata, JP;

Ryuichi Sahara, Hirakata, JP;

Nozomi Shimoishizaka, Kyoto, JP;

Takahiro Kumakawa, Takatsuki, JP;

Kazuyuki Kaino, Hirakata, JP;

Yoshifumi Nakamura, Neyagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3498 ; H01L 2/3538 ;
U.S. Cl.
CPC ...
H01L 2/3498 ; H01L 2/3538 ;
Abstract

Disclosed is a semiconductor device comprising a first semiconductor element with an arrangement of first element electrodes , a second semiconductor element with an arrangement of second element electrodes , a connection member electrically connecting together a portion of the first element electrodes and the second element electrodes , an insulation layer covering a major surface of the first semiconductor element and a backside surface of the second semiconductor element , a wiring layer formed on the insulation layer and electrically connected to the first element electrode portion exposed in an opening portion , and an external electrode formed, as a portion of the wiring layer , on the insulation layer


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