The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2003
Filed:
Jul. 30, 2001
Shinichi Ogimoto, Ebina, JP;
Shibaura Mechatronics Corporation, Yokohama, JP;
Abstract
A part mounting system requires a relatively small floor space for installation. A bonding apparatus ( ) includes a temporary-bonding unit ( ) that bonds a plurality of FPCs to which ACFs are attached, respectively, successively to a glass substrate positioned by an aligning apparatus ( ), and a permanent-bonding unit ( ) that bonds the plurality of FPCs temporarily bonded to the glass substrate simultaneously by heating. Each of the temporary-bonding unit ( ) and the permanent-bonding unit ( ) has a pair of pressing devices respectively for pressing the glass substrate and the FPC from above and from below the glass substrate. Each pressing device is capable of selectively applying either a bonding pressure or a backup pressure to the glass substrate and the electronic part.