The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2003

Filed:

Aug. 24, 2001
Applicant:
Inventors:

Patrick D. Boyd, Aloha, OR (US);

Al LaValle, Beaverton, OR (US);

Jarett L. Rinaldi, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02G 3/08 ;
U.S. Cl.
CPC ...
H02G 3/08 ;
Abstract

An apparatus and methods for attaching a component to a substrate, which allows through-hole mount electronic components to be attached to the substrate in a stabilized, horizontal orientation, without requiring prior lead preparation (e.g., bending). The apparatus is, in general, a socket including a housing having a first surface, a second surface, and an attachment surface. A recess is defined within the housing, wherein the recess comprises a component chamber extending from the housing first surface to a horizontal portion of at least one lead guide channel that extends from the component chamber to the housing second surface. The lead guide channel includes a sloped wall extending from the component chamber toward the lead guide channel. A lid is attached to the housing and adapted to move from an open position to a closed position abutting the housing second surface.


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