The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2003

Filed:

Nov. 07, 2000
Applicant:
Inventors:

Thien T. Nguyen, Austin, TX (US);

Valentin Medina, Jr., Austin, TX (US);

Douglas J. Dopp, Austin, TX (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25F 5/00 ;
U.S. Cl.
CPC ...
C25F 5/00 ;
Abstract

Etch residue, resulting from a process used in forming a via, is removed using a process that does not require using a liquid chemical solvent and does not result in excessive charge build-up in the via. One step is to use a fluorocarbon and oxygen. These gases are energized by both microwave and RF. Another step is to introduce argon, in addition to the other two gases, also energized by microwave and RF. This has the effect of removing any additional residue which tends to stick on the surface above the via as well completing the removal of etch residue in the via. An additional step is simply to apply de-ionized water to remove any remaining fluorinated residue that, as a result of the preceding two steps, is highly soluable in water.


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