The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 2003

Filed:

Jul. 16, 2002
Applicant:
Inventors:

Hyung-Shin Kwon, Seoul, KR;

Joon-Yong Joo, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/1336 ;
U.S. Cl.
CPC ...
H01L 2/1336 ;
Abstract

The present invention provides a method of forming a semiconductor device spacer. In the method, a gate pattern is formed on a semiconductor substrate, and a first insulation layer, a second insulation layer, and a third insulation layer are sequentially formed over substantially the entire surface of the resultant structure. The second and third insulation layers are formed of the same material under a first pressure and a second pressure higher than the first pressure, respectively, and preferably of silicon nitride, using a low pressure chemical vapor deposition (LPCVD) technique. The third and second insulation layers are sequentially, anisotropically etched until the first insulation layer is exposed, thereby forming a spacer and a second insulation pattern. The spacer is selectively removed by an isotropic etching method, to minimize the recessed extent of the second insulation pattern. The exposed first insulation layer is etched to form a first insulation pattern.


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