The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2003
Filed:
Aug. 11, 2000
Tze Liang Lee, Hsin-chu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin Chu, TW;
Abstract
A method for forming copper pad redistribution on a flip chip and structures formed by the method are disclosed. The method is compatible with a copper dual damascene process such that, after a substrate surface is planarized by chemical mechanical polishing, a single photomask can be used to pattern a plurality of redistribution pads, redistribution vias and redistribution lines. After the openings are filled with copper by an electroplating or an electroless plating technique, the top of the structure is again chemical mechanical polished to produce a planarized surface and resulting redistribution pads and redistribution lines. A sealing layer such as silicon nitride may be coated on the final structure as a moisture barrier.