The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2003
Filed:
Aug. 21, 2001
Jimmy Hwee Seng Chew, Singapore, SG;
Kim Hwee Tan, Singapore, SG;
Advanpack Solutions Pte LTD, Singapore, SG;
Abstract
A predetermined amount of solder ( ) is deposited on the free ends of copper posts ( ) extending from die pads of a semiconductor die ( ). The solder ( ) is coated with flux ( ) and the semiconductor die ( ) is placed on a leadframe ( ) with the solder deposits ( ) abutting interconnect locations ( ) on inner lead portions ( ). When reflowed, the solder deposits ( ) melt and with the assistance of the flux ( ) forms solder interconnects between the free ends of the copper posts ( ) and the interconnect locations ( ). Due to the predetermined amount of solder ( ) deposited on the free ends of the copper posts ( ), the molten solder ( ) tends not to flow away from the interconnect location ( ). Thus, advantageously allowing a substantial portion of the solder deposit ( ) to remain at the interconnect locations ( ) to form solder interconnects.