The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 15, 2003

Filed:

Feb. 01, 2002
Applicant:
Inventors:

Hsin-Tang Peng, Hsinchu Hsien, TW;

Yung-Ching Wang, Kaohsiung Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract

A method of forming contact plugs is used on a semiconductor substrate with at least four adjacent gate conducting structures, wherein a second gate conducting structure and a third gate conducting structure are formed within an active area. First, the gap between the second gate conducting structure and the third gate conducting structure is filled with a first conductive layer. Then, an inter-layered dielectric (ILD) layer with a planarized surface is formed on the entire surface of the substrate to cover the first conductive layer. Next, a bitline contact hole is formed in the ILD layer to expose the first conductive layer. Thereafter, the bitline contact hole is filled with a second conductive layer to serve as a bitline contact plug.


Find Patent Forward Citations

Peng, Hsin-Tang. (2003). Method of forming contact plugs (U.S. Patent No. 6548394). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6548394

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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