The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2003
Filed:
Feb. 12, 2001
Applicant:
Inventor:
Takao Inaba, Mitaka, JP;
Assignee:
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 7/00 ;
U.S. Cl.
CPC ...
B24B 7/00 ;
Abstract
In a wafer polishing apparatus according to this invention, waiting units having upper-lower two-stage wafer placement tables each for temporarily keeping a wafer from a load/unload unit to a polishing head or vice versa are provided to a polishing unit , and the upper/lower stage wafer placement tables can move individually. A spindle-washing unit for washing polishing heads is disposed inside a lower space below the waiting units.