The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2003
Filed:
Mar. 16, 2001
Masahiro Iba, Aichi, JP;
Hisashi Wakako, Aichi, JP;
Kazuhisa Sato, Aichi, JP;
Haruhiko Murata, Aichi, JP;
Kazuyuki Takahashi, Aichi, JP;
Kenzo Kawaguchi, Aichi, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A printed-wiring substrate includes internal dielectric resin layers and . A main-surface-side external dielectric resin layer is formed on the internal dielectric resin layer such that the surface thereof serves as a substrate main-surface A. A back-surface-side external dielectric resin layer is formed on the internal dielectric resin layer such that the surface thereof serves as a substrate back-surface B. A surface A of the main-surface-side internal dielectric resin layer and a surface A of the back-surface-side internal dielectric resin layer are roughened. The substrate main-surface A and the substrate back-surface B are roughened such that surface roughness thereof is lower than that of the surfaces A and A.