The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Jan. 09, 2001
Robert J. von Gutfeld, New York, NY (US);
James H. Glownia, Somers, NY (US);
James P. Doyle, Bronx, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A metallized pattern, used as an electrical conductor, is altered by means of standard lithographic processes to have regions of interspersed missing metal, or voids, in a specified region of the pattern. The voids in the conducting pattern allow radiation, emanating from various angles, to penetrate through the voids so that a glue seal, disposed underneath the pattern, can be exposed to the radiation and thus activated and cured. The preferred application is found in flat panel displays where radiation is required to cure a glue seal that affixes two substrates to one another. The openings in the metallized pattern in the region of the glue seal minimize the shadowing, caused by the solid portions of the pattern, which can result in the lack of glue seal curing or polymerization. The absence of shadowing assures that the glue seal is fully cured and will not contaminate the liquid crystal after final processing.