The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Jan. 18, 2001
Kenichi Nakayama, Kanagawa, JP;
Satoshi Adachi, Kanagawa, JP;
Mitutoyo Corporation, Kawasaki, JP;
Abstract
Both a sensor portion and a signal processing portion are provided on a glass board. The sensor portion is formed by subjecting a conductive layer to the patterning process. A gold coupling layer is provided on the conductive layer and the signal processing portion is formed by the flip chip method on the coupling layer. The sensor portion and the signal processing portion may be formed on the major surface and the rear surface of the glass board and these portions may be coupled by through holes. Since the signal processing portion as well as the sensor portion is formed on the glass board, the wiring distance can be made shorter and the entire size of the sensor can be miniaturized.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile