The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2003
Filed:
Dec. 15, 2000
Yasuhiro Sugaya, Osaka, JP;
Koichi Hirano, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Yasuyuki Matsuoka, Osaka, JP;
Satoru Yuuhaku, Osaka, JP;
Toshiyuki Asahi, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module includes the insulating substrate made of a first mixture and a second mixture wiring patterns and formed on one principal surface and another principal surface of the insulating substrate , a circuit component electrically connected to the wiring pattern and sealed with the second mixture in an internal portion of the insulating substrate , the inner via conductor electrically connecting the wiring pattern and