The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2003
Filed:
Jun. 02, 2000
Motohide Takeichi, Kanuma, JP;
Yukio Yamada, Kanuma, JP;
Sony Chemicals Corp., Tokyo, JP;
Abstract
A method for mounting electronic elements, comprises the step of arranging a thermosetting adhesive between a circuit board, situated on a stage, and an electronic element to be connected with the wiring pattern of the circuit board, and then bonding the electronic element to the circuit board by the application of heat and pressure from the electronic element side. The electronic element is temporarily thermocompression-bonded to the circuit board such that the thermosetting reaction rate of the thermosetting adhesive on the side of the circuit board is lower than the thermosetting reaction rate on the side of the electronic element. The thermosetting adhesive is then set finally in order to bond the electronic element to the circuit board.