The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2003
Filed:
Jun. 25, 2001
Bill Planey, Plano, TX (US);
Lovoltech Inc., Santa Clara, CA (US);
Abstract
A semiconductor package including a bottom leadframe having a bottom plate portion and a first terminal extending from the bottom plate portion, and a second terminal being co-planar with the first terminal. The semiconductor package also comprises a semiconductor power enhancement mode JFET die having a bottom surface and a top surface on which a first metalized region and a second metalized region are disposed. The bottom surface of the JFET die is coupled to the bottom plate of the leadframe. The semiconductor package also comprises a copper plate coupled to and spanning a substantial part of the first metalized region, and at least one beam portion sized and shaped to couple the copper plate portion to the second terminal such that it is electrically coupled to the source.