The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Apr. 10, 2001
Tetsuya Matsuura, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
The present invention provides an inexpensive semiconductor module of large capacity capable of being formed into a small-sized semiconductor module without using any special assembling component irrespective of thickness of a semiconductor device to be packaged therein. A semiconductor module unit is formed by packaging a bump electrode of a semiconductor device in electrode pad that are disposed on upper and lower faces of a unit substrate . A mother substrate is provided with upper and lower faces on which an electrode pad of a circuit pattern is formed, and a center part in which welding balls of same diameter can be packaged. A semiconductor module unit is arranged on both faces of the mother substrate so that the semiconductor devices may be inserted back to back with a small distance between them. The unit substrate and the electrode pads of the mother substrate are conductively connected through a connection bump