The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Apr. 30, 2001
Katsuo Kawaguchi, Ogaki, JP;
Ibiden Co., Ltd., Ogaki, JP;
Abstract
A test coupon is used to evaluate characteristics of multi-layer printed wiring boards. The coupon includes a multi-layer substrate which has at least first and second wiring layers. The first and second wiring layers are configured to correspond to a tested wiring layer and another wiring layer of the multi-layer printed wiring boards, respectively. Each of first and second through hole groups has a plurality of through holes which pass through the multi-layer substrate and which are arranged in an arranging direction. A first and second conductor patterns which are provided on the first and second wiring layers respectively extend substantially along the arranging direction.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile