The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Oct. 31, 2000
Applicant:
Inventor:
Thomas Laursen, Tempe, AZ (US);
Assignee:
SpeedFam-IPEC Corporation, Chandler, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ;
U.S. Cl.
CPC ...
H01L 2/1302 ;
Abstract
The invention provides a method of fabricating semiconductor chips that includes modifying physical properties of selected deposit fill layers over patterns having up-features and down-features, with fill to be retained in down-features. The modification enhances chemical mechanical polishing rates, or other polishing, of the modified fill layers to reduce dishing of fill material and achieves this without substantially affecting the electrical properties of the final semiconductor chip product.