The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2003
Filed:
Apr. 28, 2000
Roland Stalder, Zürich, CH;
ESEC Trading SA, Cham, CH;
Abstract
An apparatus for mounting semiconductor chips on a substrate with which the semiconductor chips are presented on a foil clamped in a frame at a first location A comprises a chip gripper for the transport of the semiconductor chip presented at the first location A to a second location located on the substrate, a movable table for accepting the frame, a chip ejector arranged underneath the foil at the first location A the upper surface of which facing towards the foil has holes connected to a vacuum source, as well as a measuring camera directed at the first location A for establishing the position of the presented semiconductor chip. Correction of a possible position deviation of the presented semiconductor chip from its set position takes place in accordance with the invention in that the foil is secured by the chip ejector by means of vacuum and then at least the upper surface of the chip ejector facing towards the foil is moved in the plane running parallel to the under side of the foil.