The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2003
Filed:
Sep. 28, 2000
Applicant:
Inventors:
Hiep V. Nguyen, Santa Clara, CA (US);
Henry Acedo, Morgan Hill, CA (US);
Smith J. Johnson, Sunnyvale, CA (US);
Kevin Weaver, San Jose, CA (US);
Assignee:
National Semiconductor Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/166 ;
U.S. Cl.
CPC ...
H01L 2/166 ;
Abstract
An integrated circuit backside preparation process back-thins a die using a dry etch process. A wet etch process decaps the integrated circuit to expose the die. After polishing, the prepared integrated circuit is ready for a backside debug analysis.