The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2003
Filed:
Nov. 14, 2000
Applicant:
Inventors:
Takeo Hara, Tokyo, JP;
Shin-ichiro Iwanaga, Tokyo, JP;
Hozumi Sato, Tokyo, JP;
Ryoji Setaka, Tokyo, JP;
Assignee:
JSR Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/24 ; B29C 6/724 ; C21D 1/04 ;
U.S. Cl.
CPC ...
H01B 1/24 ; B29C 6/724 ; C21D 1/04 ;
Abstract
A heat-conductive sheet comprising a cured or semi-cured binder wherein a carbon fiber is orientated in the direction of the thickness of the heat-conductive sheet. This heat-conductive sheet exhibits a high anisotropic heat conductivity along the direction of the thickness thereof to thereby enable efficiently releasing heat from a heating element such as a semiconductor element or semiconductor package. Moreover, the heat-conductive sheet is excellent in not only heat resistance, durability and mechanical strength but also adherence to the heating element.