Semiconductor device manufacturing method to reduce process induced stress and crystalline defects

Abstract

To reduce dislocations produced in the formation of shallow trench isolation regions in a semiconductor substrate, the semiconductor substrate is annealed in N ambient pressure with an O partial pressure of less than about 10 at a temperature between about 950 C.° and about 1055 C.°. In addition, a method to reduce crystalline defects in semiconductor manufacturing in which a metal is deposited on an insulator to form metal silicide is provided. The method provides for etching the insulator to create an overhang by an amount equal to at least one half of the thickness of the metal, thereby creating a void between the surface of the semiconductor substrate and the insulator. The metal is deposited on the first insulator and on the surface of the semiconductor substrate and the semiconductor substrate is heated thereby forming metal silicide on the surface of the substrate.