The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2003
Filed:
Oct. 06, 2000
Applicant:
Inventor:
Hirokazu Oikawa, Tokyo, JP;
Assignee:
NEC Compound Semiconductor Devices, Ltd., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/13065 ; H01L 2/1311 ;
U.S. Cl.
CPC ...
H01L 2/13065 ; H01L 2/1311 ;
Abstract
Lower metal wiring is formed on a base insulating film. A BCB film which is formed of a BCB (benzocyclobutene) resin is formed on the base insulating film and metal wiring. A SiO film is formed on the BCB film. A resist film is formed on the SiO film, and patterned using a lithography technique. The SiO film is etched using the resist film as a mask. The BCB film is anisotropically etched with a mixture of Cl /BCl /O using the SiO film as a mask, thereby to form a contact hole. The contact hole is filled with a conductor, thereby forming upper metal wiring.