The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2003
Filed:
Oct. 09, 2001
Water Tsai, Taichung, TW;
Yuan-Fu Lin, Taichung, TW;
Abstract
A semiconductor package and a method for fabricating the same are proposed, in which a chip is attached to a die pad formed with an opening in a manner that the chip covers the opening and a surface of the chip is partially exposed to the opening. A covering layer is formed on the exposed surface of the chip, so as to fill a gap formed between the chip and the die pad in proximity to the opening, and allow air in the gap to be dissipated. This makes an encapsulant formed for encapsulating the chip and the die pad with no void formed therein, so that no die crack or popcorn effect occurs in the fabricated product, and thus quality and reliability of the semiconductor package can be assured.