The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2003
Filed:
Jan. 05, 2001
Abstract
A method for fabricating a stacked chip package comprises the steps of: (a) attaching a lower chip to a substrate or a lead frame; (b) electrically coupling the lower chip to the substrate or the lead frame; (c) providing a dummy chip with a film adhesive on a upper surface thereof; (d) attaching the dummy chip to the lower chip through an adhesive layer wherein a lower surface of the dummy chip is in contact with the adhesive layer; (e) attaching an upper chip to the dummy chip through the film adhesive; (f) electrically coupling the upper chip to the substrate or the lead frame; and (g) encapsulating the lower chip and the upper chip against a portion of the substrate or the lead frame with a molding compound. Since the dummy chip is bonded to the upper chip via a film adhesive, it is not necessary to monitor the thickness of the film adhesive after the upper chip is bonded to the dummy chip.