The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2002
Filed:
Jun. 30, 2000
Applicant:
Inventor:
Wen-Ying Wen, Kaohsiung Hsien, TW;
Assignee:
Windbond Electronics Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/18234 ;
U.S. Cl.
CPC ...
H01L 2/18234 ;
Abstract
In a traditional ROM semiconductor process, ROM codes are performed by ion implantation. Due to the limitations of ion implantation energy and threshold control, the implantation for program codes must be performed before forming an inter-layer oxide layer. Therefore, the required delivery time of the process becomes longer. The invention provide a method of manufacturing ROMs that can shorten delivery time by using only one mask to simultaneously form program codes and contact windows.