The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2002
Filed:
Sep. 19, 2001
Daisuke Komada, Kasugai, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor integrated circuit device, having: a plurality of semiconductor elements formed in a central circuit area of a semiconductor chip; a plurality of insulating layers formed on the semiconductor chip; cavities for forming wiring layers of a multi-layer structure, each of the cavities in each wiring layer having a via hole and a wiring pattern trench; wiring layers of the multi-layer structure including a via conductor filled in the via hole and a wiring pattern filled in the wiring pattern trench; moisture-proof ring trenches of a multi-layer structure corresponding to the cavities for forming the wiring layers of the multi-layer structure, the moisture-proof ring trenches surrounding the circuit area in a loop-shape and formed through the insulating layers, a width of each of the moisture-proof ring trenches corresponding to a corresponding one or ones of the via holes being set smaller than a minimum diameter of the via holes; and a conductive moisture-proof ring filled in a corresponding one of the moisture-proof ring trenches. In etching via holes and a moisture-proof ring trench, it is possible to suppress the stopper film in the moisture-proof ring trench from being thinned and to minimize damages to the underlying wiring layer.