The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2002
Filed:
Aug. 25, 2000
Chi Chuan Wu, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Tantzu Taichung, TW;
Abstract
The present invention is characterized by replacing solder balls with cylindrical terminals in an IC package where at least a chip is located on the same side of the substrate of the IC package as the solder balls are. Due to the larger length of the cylindrical terminals which are located on the same side of the substrate of the IC package as at least a chip is, at least a chip with relatively thick size can be accommodated in the IC package provided by the present invention, without need of increasing terminal pitch (such as the ball pitch in a conventional BGA package). The accommodation of relatively thick chip in the IC package provided by the present invention leads to elimination or significant reduction of cost of back grinding of the chip, and to significant improvement on the failure rate resulting from the thinness of the chip in a conventional IC package, while without need of augmenting the size of the substrate of the IC package as a result that the terminal pitch based on the present invention needs not be increased.