The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2002
Filed:
Oct. 19, 2000
Robert G. Mazur, Sewickley, PA (US);
Robert J. Hillard, Avalon, PA (US);
Solid State Measurements, Inc., Pittsburgh, PA (US);
Abstract
A semiconductor wafer probe assembly ( ) includes a chuck assembly ( ) configured to receive a back surface ( ) of a semiconductor wafer ( ) and an electrical contact ( ) for contacting the semiconductor wafer ( ). A probe ( ) having an elastically deformable conductive tip ( ) is movable into contact with a semiconducting material forming a front surface ( ) of the semiconductor wafer ( ) or with a front surface ( ) of a dielectric ( ) formed on the front surface of the semiconducting material. A tester ( ) is connected for applying an electrical stimulus between the electrical contact ( ) and the conductive tip ( ) for measuring a response to the electrical stimulus and for determining from the response at least one electrical property of the semiconducting material and/or the dielectric ( ).