The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2002
Filed:
Sep. 13, 2000
Voya R. Markovich, Endwell, NY (US);
Douglas O. Powell, Endicott, NY (US);
Amit K. Sarkhel, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention provides an integrated semiconductor module comprising a chip, interposer, and substrate. The module is adapted to be mounted on a traditional circuit card carrying multiple other components. The chip of the present invention can be a conventional IC chip or chip package, including ball grid array packages, and will simply be referred to hereinafter as a “chip.” The interposer of the present invention is a conventional thin film interposer, such as those composed of a polyimide material and fabricated on a glass carrier plate. The substrate of the present invention is a conventional circuitized substrate, such as a BGA or laminate substrate, that is commonly employed in carrying a chip on a circuit card. In its assembled state, the present invention comprises an interposer mounted on top of a substrate with the electrical contacts formed on the lower surface of the interposer positioned in electrical communication with respective ones of electrical contacts formed on the upper surface of the substrate. A non-conductive material, such as an epoxy resin, fills the voids between the interposer and substrate created by the electrical connections. The epoxy resin forms a mechanical bond between the interposer and substrate, thereby enhancing the structural integrity of the unit. Moreover, by filling the voids between the electrical connections, essentially no foreign particles can become entrapped therein and cause electrical malfunctions. Accordingly, the environmental and operational integrity of the unit is also enhanced.