The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2002
Filed:
Mar. 30, 2001
Applicant:
Inventors:
Ryo Enomoto, Gifu, JP;
Hideo Yabashi, Gifu, JP;
Tadashi Sugiyama, Gifu, JP;
Kenzo Hatada, Katano, JP;
Assignee:
Ibiden Co., LTD, Ogaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/348 ; H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/348 ; H01L 2/352 ;
Abstract
A via is formed by copper plating on a surface of an aluminum electrode pad of a semiconductor chip . Since the via having flexibility absorbs a stress generated due to a difference in thermal expansion between the semiconductor chip and a substrate, the semiconductor chip can be mounted onto the substrate with high reliability and connection reliability of the semiconductor chip can be enhanced.