The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2002

Filed:

Mar. 19, 2001
Applicant:
Inventor:

Markus K. Liebhard, Gilbert, AZ (US);

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract

A semiconductor package and a method for fabricating a semiconductor package are disclosed. The semiconductor package includes semiconductor chip attached to a circuit board that includes at least one lateral slot formed through the circuit board. Provision of the slot reduces stresses in the circuit board that are manifested by warpage. The semiconductor chip may be positioned in a central aperture of the circuit board and held therein by hardened encapsulant material.


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