The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2002
Filed:
Jun. 27, 2001
Applicant:
Inventors:
Qwai H. Low, Cupertino, CA (US);
Ramaswamy Ranganathan, Saratoga, CA (US);
Sengsooi Lim, San Jose, CA (US);
Assignee:
LSI Logic Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; B05D 1/512 ;
U.S. Cl.
CPC ...
H01L 2/144 ; B05D 1/512 ;
Abstract
An improved tape substrate design for a semiconductor package is disclosed. The tape substrate semiconductor package includes a plurality of die pads, a plurality of vias, and a pattern of metal traces interconnected between the die pads and the vias to form circuitry on the tape substrate. According to the method and apparatus of the present invention an extra metal layer is added at the circuitry to increase rigidity of the tape substrate, thereby reducing warpage without adding to the thickness of the tape substrate package.