The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2002

Filed:

Jan. 04, 2000
Applicant:
Inventor:

Jeremy Lansford, Austin, TX (US);

Assignee:

Advanced Micro Devices, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/100 ; H01L 2/1306 ; G06F 1/900 ;
U.S. Cl.
CPC ...
H01L 2/100 ; H01L 2/1306 ; G06F 1/900 ;
Abstract

A method includes measuring a surface non-uniformity of a wafer. A current state of an etch processing tool is determined. The surface non-uniformity of the wafer is compared with the current state of the processing tool. An operating parameter of the processing tool is adjusted based on the comparison of the surface non-uniformity of the wafer with the current state of the processing tool. A system includes a processing tool, a plurality of measuring devices, and a process controller. The processing tool is adapted for etch processing of a wafer. The plurality of measuring devices measure a surface non-uniformity of the wafer and determine a current state of the processing tool. The process controller compares the surface non-uniformity of the wafer with the current state of the processing tool and adjusts an operating parameter of the processing tool based on the comparison.


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