The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2002

Filed:

Aug. 22, 2001
Applicant:
Inventors:

Bo Jin, Campbell, CA (US);

Manoj Roge, San Jose, CA (US);

Assignee:

Cypress Semiconductor Corp., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 1/500 ;
U.S. Cl.
CPC ...
G11C 1/500 ;
Abstract

Architecture, circuitry, and methods are provided for producing a content addressable memory (CAM). The CAM includes one or more CAM cells arranged in an array. Each CAM cell is symmetrical about its x- and y-axis to form rows and columns of the array. Additionally, each CAM cell can use either SRAM or DRAM storage cells implemented in either a binary or ternary arrangement. If the CAM cell is a ternary SRAM design, then the cell size is no more than 4 microns by 1-½ microns, assuming a 0.15 micron critical dimension. Critical dimension is noted as the smallest resolvable size for the particular process being employed. The CAM cell utilizes a selection circuitry that will disable the compare circuit during times when a compare operation is not being performed. This will ensure the compare circuit will not consume power during, for example, a read or write operation. Each CAM cell uses no more than eight conductors per cell, wherein the conductors are of minimum width and pitch arranged co-planar on a single metal layer. Another metal layer utilizes local interconnects and a pair of conductors which carry the differential bit lines and compare lines. The local interconnects do not extend across the entire cell and, therefore, are localized to only a small region of a cell to effectuate power and ground supplies to the CAM cell.


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