The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2002
Filed:
Sep. 14, 2000
Fumio Miyajima, Nagano, JP;
Apic Yamada Corp., Nagano, JP;
Abstract
The method of resin molding and a resin molding machine are capable of uniformly control amount of the resin for molding a work piece and pressure of the melted resin. A parting face of one of molding dies, which includes a pot and a cavity, is covered with release film. A work piece to be molded is set in the cavity. Resin is set in the pot. Parts of the release film, which enclose the work piece except a resin path, are clamped by the molding dies. Capacity of the cavity is reduced when the parts of the release film are clamped. The resin is sent from the pot to the cavity so as to mold the work piece in the cavity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile