The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2002
Filed:
Mar. 02, 2001
Mitsuo Zen, Tokyo, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
A wave soldering apparatus includes a solder reservoir adapted to contain molten solder, and a solder nozzle disposed in the solder reservoir and extending up above the molten solder. The nozzle provides a substantially turbulent free solder wave under a printed circuit board while the board is moved in a predetermined path. A tray is pivotably mounted to the nozzle and angularly moved to vary the flow rate of the molten solder. A shroud is mounted adjacent to and associated with the tray to define a contained space into which an inert gas is supplied to provide an inert gas atmosphere. The shroud includes a canopy extending over a portion of the tray. The canopy extends substantially parallel to the predetermined path and is adjustably positioned in response to angular position of the tray to ensure that the board exits from the solder wave within the inert gas atmosphere.