The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Aug. 04, 2000
Masataka Takehara, Kyoto, JP;
Towa Corporation, Kyoto, JP;
Abstract
In a resin sealing method, a plurality of semiconductor chips are placed in line on a sheet-type substrate with an adhesive tape, and electrodes provided on the semiconductor chips and the sheet-type substrate are connected with each other with wires, so that the connected substrate is fixed to a mold surface of a lower mold. Then, the lower mold and an upper mold are closed and thereafter molten resin is injected into upper cavities and lower cavities provided in line respectively and hardened. Then, the upper and lower molds are opened to take out the sheet-type substrate having the plurality of semiconductor chips sealed thereto, and the sheet-type substrate is cut along the boundaries between the semiconductor chips by dicing for completing each package. According to this method, particularly a BOC type CSP can be efficiently sealed with resin in high dimensional accuracy.