The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Dec. 08, 2000
Applicant:
Inventors:
Kanji Otsuka, Higashiyamato-Shi Tokyo, JP;
Tamotsu Usami, Kokubunji-Shi Tokyo, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/204 ; H05K 1/11 ;
U.S. Cl.
CPC ...
H01R 1/204 ; H05K 1/11 ;
Abstract
Signal wirings are formed on a pair of substrates and the substrates are joined together through an insulating layer so that the signal wirings are placed in parallel and facing to each other. The surfaces of the overlapping faces of the signal wirings are made smooth, and the roughness of the same surfaces is smaller than the skin depth &dgr; due to the skin effect, preferably less than one third, for minimizing the increase in the electric resistance due to the skin effect.
Otsuka, Kanji. (2002). Wiring substrate and process for producing the same (U.S. Patent No. 6476330). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6476330
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile