The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2002
Filed:
Jul. 06, 2001
Ja-Hyung Han, Suwon, KR;
Samsung Electronics Co., Ltd., Kyungki-do, KR;
Abstract
A method of manufacturing a semiconductor device for protecting a Cu layer from post chemical mechanical polishing (CMP) corrosion and CMP equipment therefore wherein, when wafers on which a Cu layer is formed wait to be transferred to a cleaning system after being polished in a CMP equipment, the wafers collected at a stand-by station are supplied with a solution containing a corrosion inhibitor, thus at least keeping the polished surface of Cu layer wet with the solution. Then, the wafers collected at the stand-by station are transferred to the cleaning system and cleaned. In the present invention, the solution uses a solution in which the corrosion inhibitor is added to de-ionized water. Furthermore, while transferring the wafers, the surfaces of the transferred wafers are kept wet with a solution containing a corrosion inhibitor.