The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2002

Filed:

Dec. 13, 1999
Applicant:
Inventors:

Toshio Kubota, Tokyo, JP;

Masumi Sugawara, Tokyo, JP;

Takehiro Horinaka, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 4/900 ;
U.S. Cl.
CPC ...
B24B 4/900 ;
Abstract

The present invention relates to a film thickness measuring method measuring a film thickness of an element formation layer formed on a substrate and its object is to provide a film thickness measuring method which can measure a residual film thickness of a polishing object film in a polishing process at a high accuracy. In a fabrication method of a thin film magnetic head, alumina is coated over a dummy layer and a bottom shielding layer after forming the dummy layer along with the bottom shielding layer and a planarized layer is formed by polishing the surface thereof using a CMP. Next, after forming a top shielding layer over the bottom shielding layer , a planarized layer is form by embedding alumina. A film thickness of an embedded on the dummy layer is measured by a non-contact optical film thickness measuring equipment and a film thickness of the top shielding layer is measured based on the film thickness.


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