The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2002

Filed:

Jan. 30, 2001
Applicant:
Inventors:

Zhineng Fan, Santa Clara, CA (US);

Ai D. Le, Sunnyvale, CA (US);

Che-Yu Li, Ithaca, NY (US);

Assignee:

High Connection Density, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/200 ;
U.S. Cl.
CPC ...
H01R 1/200 ;
Abstract

The present invention provides a carrier with electrical shielding of individual contact elements, resulting in LGA interposer connectors with improved electrical performance. The carrier includes a plurality of openings, each of which may contain an individual contact element. The openings may be plated with conductive material, and may also be commoned to one or more reference voltages (e.g., ground) present on at least one conductive layer of the carrier. The carrier may be as simple as a single unified structure with a conductive layer on one outer surface, or much more complex, having many layers of dielectric and conductive material. The carrier may also provide improved retention of the individual contact elements. The process to assemble one embodiment of the carrier is also disclosed.


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