The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2002
Filed:
Jun. 30, 2000
Applicant:
Inventor:
Hyung Ju Lee, Seoul, KR;
Assignee:
Amkor Technology, Inc., Chandler, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
A leadframe having a mold inflow groove provides for an increase in the number of inner leads for connecting with outer electrical sources and accurate singulation. A molding compound is introduced through mold inflow grooves positioned at both sides of a tie bar into the cavity so that no culls remain on the tie bar after molding. The end of a runner of the mold die is positioned at a sufficient distance away from the molding area of the leadframe to allow the top and bottom surfaces of the tie bar to remain free of culls.