The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2002

Filed:

Jul. 20, 2001
Applicant:
Inventors:

Cheng-Yi Huang, Hsin Chu, TW;

Tsung-Chieh Tsai, Tainan, TW;

Kuo-Hung Liao, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 1/600 ;
U.S. Cl.
CPC ...
C23C 1/600 ;
Abstract

A wafer support for supporting and rotating a semiconductor wafer within a rapid thermal process chamber is formed of a single member of unitary construction. The unitary member includes a first, horizontal section for supporting the periphery of the wafer thereon, and a downwardly extending cylindrical section that is mounted for rotation within the chamber. The first and second sections are integrally formed to prevent radiant energy from passing there between and comprise materials that cause the support to act as a black body, yielding more uniform heating of the wafer. A recess formed in the horizontal section receives the outer edge of the wafer and prevents radiant heat from passing between the wafer and the support in those cases where the wafer is warped.


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